20-000-025 -solderless breadboard 830 tie points

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Subject: 20-000-025 -solderless breadboard 830 tie points
20-000-025 Solderless Proto-Board System for Experimental, Prototyping, R&D, and University lab
* Size: Kydex plate: 6.875" x 3.325" x 1.465"
* 1 solderless breadboards for a total of 830 tie points
* 4 binding post: 2 black and 2 red
* Breadboard contains 2 bus strips (100 tie points each) and 1 terminal strip (630 tie points)
* 15-Day Money-Back Guarantee
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MeerKat Systems Incorporated reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
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